Samsung opens Japan AI chip R&D hub for advanced packaging collaboration
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Source: Nikkei Asia
Published: 2026-09-09 02:08 UTC+10:00
Section: General
Factuality Score: 92
Opinion Category: Neutral
Topics: Asia, South Korea, Technology & AI, Business & Economy, Asia Pacific, Technology
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Snippet:
Samsung's Jun Young-hyun, third from left, appears with leaders of Japanese suppliers Sept. 8 to open a chip packaging lab to speed technology collaboration between South Korea and Japan. (Photo by Yuki Nakao)
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