SK Hynix starts construction of first HBM chip packaging plant in US
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Source: Nikkei Asia
Published: 2026-08-28 01:31 UTC+10:00
Section: General
Factuality Score: 100
Opinion Category: Neutral
Topics: Science, Education, Property, Asia, South Korea, Business & Economy, Asia Pacific, Technology
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Snippet:
South Korea's SK Hynix's more than $4 billion construction project includes an advanced chip packaging facility as well as a research and development complex in West Lafayette, Indiana, which is home to Purdue University. (Photo by Yifan Yu)
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