SK hynix to break ground on $3.9b Indiana chip packaging plant this month
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Source: The Korea Herald
Published: 2026-08-13 15:35 UTC+10:00
Section: All News
Factuality Score: 92
Opinion Category: Neutral
Topics: South Korea, Technology & AI, World News, Technology
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Snippet:
SK hynix will hold a groundbreaking ceremony on Aug. 27 for its $3.87 billion advanced chip packaging plant in Indiana, as the South Korean memory maker steps up its US expansion in artificial intelligence chip production.
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