SK hynix to hold groundbreaking ceremony for Indiana chip packaging plant on Aug. 27
--------------------------------------------------------------------
Source: South Korea
Published: 2026-08-12 17:50 UTC+10:00
Section: General
Factuality Score: 100
Opinion Category: Neutral
Topics: South Korea
--------------------------------------------------------------------
Snippet:
SEOUL, Aug. 12 (Yonhap) -- SK hynix Inc. will hold a formal groundbreaking ceremony for its new semiconductor packaging plant in the U.S. state of Indiana on Aug. 27, industry sources said Wednesday.
--------------------------------------------------------------------