According to Korea's Hankgyung, China’s largest memory company, CXMT, which is preparing to IPO in the coming weeks, is currently testing a pilot production line for bonded DRAM in Hefei (the heart of China's semiconductor industry), aiming to achieve high-performance DRAM without using advanced EUV lithography, which is currently monopolized by Dutch ASML and faces unprecedented export controls (although according to Reuters, China has already built a prototype EUV machine).