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    China’s JCET to build new plant in Shanghai to expand advanced chip packaging

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    Source: South China Morning Post
    Published: 2026-06-25 10:30 UTC+10:00
    Section: General
    Factuality Score: 100
    Opinion Category: Neutral
    Topics: Property, Asia, Technology & AI, China, Business & Economy, Asia Pacific, Technology
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    Snippet:
    US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development
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