Samsung readies next-gen AI memeory HBM4E chip
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Source: The Korea Herald
Published: 2026-05-29 10:41 UTC+10:00
Section: All News
Factuality Score: 100
Opinion Category: Neutral
Topics: Technology & AI, World News, Technology
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Snippet:
Samsung Electronics said Friday it has begun shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the world's first shipment of the next-generation artificial intelligence memory product.
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