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    Peking University unveils 3D design tool to power Huawei’s chip ambitions

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    Source: South China Morning Post
    Published: 2026-05-28 00:00 UTC+10:00
    Section: Washington
    Factuality Score: 100
    Opinion Category: Neutral
    Topics: Education, Military & Defence, Technology & AI, US Politics, War & Conflict, Technology
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    Snippet:
    The university’s new chip design software is compatible with Huawei’s LogicFolding architecture introduced on Monday
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    >>> Read full article at South China Morning Post <<<
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