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    Hong Kong seeks to raise bond issuance ceiling to HK$900 billion

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    Source: South China Morning Post
    Published: 2026-04-10 01:22 UTC+10:00
    Section: Infrastructure Bond Programme
    Factuality Score: 100
    Opinion Category: Neutral
    Topics: Politics, Business, Transport, Property, Economy & Finance, China, World News, Business & Economy
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    Snippet:
    Government proposes to raise borrowing ceiling from HK$700 billion to HK$900 billion to fund infrastructure development
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    >>> Read full article at South China Morning Post <<<
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