SHENZHEN, China, March 31, 2026 /PRNewswire/ -- On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), developed based on the Samsung Exynos Modem chipset, has officially entered large-scale mass production. The commercial launch of this product not only marks a significant milestone in the strategic collaboration between Fibocom and Samsung, but also provides high-performance and highly reliable connectivity solutions for global 5G FWA (Fixed Wireless Access) and broadband IoT